In Stock
RL-601MA CPU Planting Tin Platform
Efficient CPU Reballing for Mobile Repair Professionals
High-Temperature Magnet • Precise Solder Ball Positioning • Prevents Mesh Jamming
₹1,650.00
Soldering Items, Stencils
Relife
Description
Reballing stencil kit for tin planting A8 – A16 CPU, iPhone 6 series to iPhone 13 series.
Built-in high temperature magnet, strong magnetic adsorption, precise positioning and no offset.
High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
Built-in high temperature magnet, strong magnetic adsorption, precise positioning and no offset.
High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
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